Custom Precision Copper Heat Sink Manufacturing: OFHC Machining & Skiving
ISO 9001 certified custom precision OFHC copper heat sinks with CNC skiving and 3-7 day prototypes.
Our Advantages:
Purity: ≥99.95% Oxygen-Free High Conductivity (OFHC) Copper.
Conductivity: Standard 401W/(m·K) for rapid thermal dissipation.
Flatness: Precision ground base with ≤0.05mm flatness for zero-gap TIM contact.
Capabilities: 5-Axis CNC Machining, High-Density Skiving, and Vacuum Brazing.
Lead Time: Prototype delivery in 3–7 days; mass production in 21 days.
Quality: ISO 9001:2015 certified; FAI (First Article Inspection) provided.

High-Performance Thermal Management: Custom Copper Heat Sink Fabrication
Effective thermal management in high-TDP (Thermal Design Power) electronics requires materials with superior flux density. We provide custom copper heat sink solutions that outperform standard aluminum by 2.1x in conductivity. By utilizing CNC machining services, we produce complex geometries including recessed pockets for IGBT modules and integrated mounting hardware for server-grade applications.

Engineering Specifications: Material Grades & Tolerances
|
Feature |
Engineering Requirement |
|
Material Grades |
C11000, C10200 (Oxygen-Free), C10100 |
|
Thermal Conductivity |
385W/m·K to 401W/m·K |
|
Machining Accuracy |
±0.02mm (Metric) / ±0.0008" (Imperial) |
|
Fin Density (Skived) |
Up to 50 fins per inch |
|
Base Surface Finish |
Ra 0.4μm to Ra 0.8μm (as machined or polished) |
|
Max Part Envelope |
600mm x 500mm x 150mm |
|
Coating Options |
Electroless Nickel (MIL-C-26074), Tin, Silver, or Passivation |

Advanced Manufacturing: Skiving, CNC Milling, and Assembly
Skived Fin Technology for Zero Interface Resistance
Our skiving process involves peeling fins directly from a solid copper slab. This creates an integrated fin-to-base structure, ensuring there is no thermal interface resistance typically found in bonded or soldered heat sinks. This is the optimal choice for high-power inverters.
CNC Machined Copper Heat Sink with Integrated Heat Pipes
For extreme power densities, we utilize 5-axis CNC machining to mill precision grooves for heat pipe embedding. We specialize in vacuum brazing and epoxy bonding of copper heat pipes and vapor chambers to enhance lateral heat spreading.

Quality Assurance: Metrology & Thermal Validation
Xiamen Dazao Machinery enforces a zero-defect policy for all medical-grade and industrial copper components:
Flatness Verification: Laser scanning of the contact base to ensure ≤0.05mm deviation.
Material Traceability: MTR (Material Test Reports) for every lot of C11000/C10200 copper.
Environmental Testing: Salt spray and humidity testing for nickel-plated surfaces to ensure 10+ year service life.

Industrial Applications: High-Density Power Systems
Our thermal solutions serve high-density power systems in telecom computing automotive and power electronics.

Telecom
5G Macro Station power amplifiers and RF modules.

Computing
Enterprise Server CPU/GPU thermal modules and data center cooling.

Automotive
EV Traction Inverters, DC-DC Converters, and On-board Chargers (OBC).

Power Electronics
IGBT modules for high-speed rail and wind power converters.
FAQs

01.Why choose Oxygen-Free Copper (OFHC) for a heat sink?
02.What is the minimum fin thickness achievable through skiving?
03.Can you provide CNC machined copper heat sinks with nickel plating?
04.How do you manage the "softness" of copper during CNC machining?
05.What file formats do you require for a custom copper heat sink quote?
06.Do you support low-volume prototyping for thermal testing?
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